Superior Conductivity: Surface resistivity can be precisely tailored from 10² to 10⁶ Ω·cm, effectively preventing electrostatic discharge and protecting sensitive electronics. High Strength & Stiffness: Carbon fiber reinforcement provides a modulus and dimensional stability far exceeding standard plastics, while maintaining good toughness. Exceptional Dimensional Stability: Low moisture uptake ensures parts maintain their dimensions and performance even in humid environments, ideal for high-precision applications. Excellent Processability: Suitable for major industrial 3D printing processes like Selective Laser Sintering (SLS) and Multi Jet Fusion (MJF), as well as traditional injection molding, producing parts with uniform surface quality and fine details.

Syensqo Polyamide (Nylon): PARA Ixef® 1002 Syensqo Polyamide (Nylon): PARA Ixef® 1022 Syensqo Polyamide (Nylon): PARA Ixef® 1025 Syensqo Polyamide (Nylon): PARA Ixef® 1027 Syensqo Polyamide (Nylon): PARA Ixef® 1032 Syensqo Polyamide (Nylon): PARA Ixef® 1038 Syensqo Polyamide (Nylon): PARA Ixef® 1521 Syensqo Polyamide (Nylon): PARA Ixef® 1524 Syensqo Polyamide (Nylon): PARA Ixef® 1622 Syensqo Polyamide (Nylon): PARA Ixef® 2011 Syensqo Polyamide (Nylon): PARA Ixef® 2030 Syensqo Polyamide (Nylon): PARA Ixef® 3008 ECHO RF Syensqo Polyamide (Nylon): PARA Ixef® 3008 Syensqo Polyamide (Nylon): PARA Ixef® 3012 ECHO RF Syensqo Polyamide (Nylon): PARA Ixef® 3012 Syensqo Polyamide (Nylon): PARA Ixef® 5002 Syensqo Polyamide (Nylon): PARA Ixef® BM-1524 Syensqo Polyamide (Nylon): PARA Ixef® BXT 2000 Syensqo Polyamide (Nylon): PARA Ixef® DW-1022 Syensqo Polyamide (Nylon): PARA Ixef® DW-1032 Syensqo Polyamide (Nylon): PARA Ixef® FC-1022 Syensqo Polyamide (Nylon): PARA Ixef® FC-1032 Syensqo Polyamide (Nylon): PARA Ixef® GS-1022 Syensqo Polyamide (Nylon): PARA Ixef® GS-5022 Syensqo Polyamide (Nylon): PARA Ixef® HC-1022 Syensqo Polyamide (Nylon): PARA Ixef® PARA PELLETS GP

LNP™ STAT-LOY™ Compound 63000CTU LNP™ STAT-LOY™ Compound AX11421 LNP™ STAT-LOY™ Compound M3000C Antistatic No PFAS intentionally added Antistatic Low ionics/Outgassing/Liquid particle count Electronic Components Low ionics/Outgassing/Liquid particle count No PFAS intentionally added Material Handling No PFAS intentionally added Transparent/Translucent Electrical Weatherable/UV stable Electronic Components Electrical Material Handling Electronic Components Mobile Phone - Computer - Tablets Material Handling Mobile Phone - Computer - Tablets

Laser Weldable 激光焊接塑料 Soudage laser des plastiques Soldagem a laser de plásticos Laserschweißen von Kunststoffen Soldadura láser de plásticos レーザー溶接プラスチック

ULTEM™ resin is a Polyetherimide (PEI), which offers a unique combination of thermal performance, high modulus, dimensional stability, near-infrared transparency, and non-halogenated FR for a wide range of demanding applications. EXTEM™ resin is well-suited for applications that require a higher thermal performance, such as co-packaged optical components. SILTEM™ resin is an easy extrudable amorphous copolymer with no intentionally added PFAS for potential use in applications such as high-performance ULTEM™ resin is a Polyetherimide (PEI), which offers a unique combination of thermal performance, high modulus, dimensional stability, near-infrared transparency, and non-halogenated FR for a wide range of demanding applications. EXTEM™ resin is well-suited for applications that require a higher thermal performance, such as co-packaged optical components. SILTEM™ resin is an easy extrudable amorphous copolymer with no intentionally added PFAS for potential use in applications such as high-performance wires and cables.

High Strength + High Toughness – Combines PA’s rigidity with ABS’s impact resistance for superior mechanical performance. Enhanced Heat Resistance – 20-30°C higher HDT (Heat Deflection Temperature) vs. pure ABS. Excellent Processability – Retains ABS’s easy molding properties while reducing PA’s processing challenges. Cost-Effective – More affordable than pure PA, yet outperforms standard ABS.